Drahtbonden

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  • Aluminiumdünndraht 25µm und 30µm
  • Größen: pad: 45; pitch: 64
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  • 8 Ebenen
  • Raster 80µm
  • Loop Längen bis 11 Millimeter
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  • Raum Temperatur härtend für geringster thermischen Stress
  • Damm and Fill Technologie
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[text tag=“p“]HWmicroLAB bietet Alu-und Gold-Drahtbonden für Prototypen und Kleinserien mit sehr kurzen Lieferzeiten an. Modernste vollautomatische Drahtbondtechnik ermöglicht die Umsetzung schwierigster Layouts mit geringsten Bondrastern.[/text] [html ] Maschinenbeschreibung
  • hochproduktive, vollautomatisierte Prozesse mit Bildverarbeitung und automatischer Deformationsregelung
  • hohe Zuverlässigkeit und Wiederholgenauigkeit durch lineare Antriebe
Standardtechnologie
  • Wedge-Wedge Aluminiumdraht: 25µm, 30µm
  • min Pad Size 50×50µm, kleinstes Raster: 64µm
  • Ball-Wedge Golddraht: 25µm
  • min Pad Size 50 x 50µm, kleinstes Raster: 80µm
  • Golddrahtbonden bei Raumtemperatur
Spezialisierte Technologie
bondbare Materialien
  • ENIG FR4, ENIPIG FR4
  • Keramiken
  • Kupferoberflächen
  • Glassubstrate
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